发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION, INSULATION FILM, PROTECTION LAYER, AND ELECTRONIC EQUIPMENT |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition superior in alkali development by achieving comparatively high yield in high elasticity when it is used for an insulation film or a protection layer. <P>SOLUTION: The photosensitive resin composition includes: an alkali-soluble resin having a mesogenic group; a photosensitive agent; and an alignment assistant agent for improving a degree of alignment of the alkali-soluble resin having the mesogenic group. The insulation film is composed of a cured matter of the photosensitive resin composition. The protection layer is composed of the cured matter of the photosensitive resin composition. Electronic equipment has the protection layer. <P>COPYRIGHT: (C)2008,JPO&INPIT |
申请公布号 |
JP2008111929(A) |
申请公布日期 |
2008.05.15 |
申请号 |
JP20060293848 |
申请日期 |
2006.10.30 |
申请人 |
SUMITOMO BAKELITE CO LTD |
发明人 |
TAKAHASHI TAISUKE;MAKABE HIROAKI |
分类号 |
G03F7/023;C08G73/06;C08K5/42;C08L79/04;C08L79/08;G03F7/004 |
主分类号 |
G03F7/023 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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