| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a cooling device in which thickness is suppressed, as well as, the cooling performance is improved. <P>SOLUTION: The cooling device is equipped with a thermal diffusion plate 36, a heat-receiving portion 37 thermally connected to a cooling object 26, being prepared on the thermal diffusion plate 36; a heat sink 38 which radiates the heat of the heat receiving portion 37 outside, being prepared on the thermal diffusion plate 36; a first end 39A connected to the heat receiving portion 37, being prepared on the thermal diffusion plate 36; and a second end 39B connected to the heat sink 38, being prepared in the opposite side to the first end 39A, and a heat pipe 39. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
