| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a circuit board in which a metal substrate is protected effectively from a chemical by etching and which is superior in mass productivity. SOLUTION: Adhesion layers 2a and 2b, insulating layers 3a and 3b and copper foils 4a and 4b are laminated on both faces of the metal substrate 1 by thermal press forming. Opening parts (window holes) 2c and 2d are formed in confronted positions of a part of the adhesion layers 2a and 2b. Circuit patterns 5a and 5b are formed by etching the copper foils 4a and 4b in such a state. An outline machining process for separating processing to reach the metal substrate 1 in a previously decided position as well as the opening parts 2c and 2d is performed. A part of the insulating layer is cut along edges 2e and 2f of the opening parts. Thus, the circuit board having the exposed end parts of the metal substrate 1 is obtained. COPYRIGHT: (C)2008,JPO&INPIT
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