Method for mounting electronic component on substrate and method for forming solder surface

摘要

A method for mounting an electronic component on a substrate includes: forming an Au bump (24) on a surface of an electrode (20) of a substrate (10) ; placing an Sn-based solder sheet (26) on the Au bump; subjecting the Sn-based solder sheet and the Au bump to reflow soldering, to thus form an Au-Sn eutectic alloy (28); smoothing the eutectic alloy; and bonding an electronic component (30) on a surface of the smoothed eutectic alloy.