发明名称 PHOTOSENSITIVE COMPOSITION, RESIN FOR USE IN THE PHOTOSENSITIVE COMPOSITION, COMPOUND FOR USE IN SYNTHESIS OF THE RESIN AND PATTERN FORMING METHOD USING THE PHOTOSENSITIVE COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive composition which substantially avoids degradation of resist pattern profile and degradation of line edge roughness performance in liquid immersion exposure as well as in ordinary exposure (dry exposure), and a pattern forming method using the same. <P>SOLUTION: The photosensitive composition contains a compound (C) represented by formula (I): (R)<SB>n</SB>-N-(A-X)<SB>3-n</SB>, wherein R each independently, when there are a plurality of R's, represents H or a monovalent organic group; A each independently, when there are a plurality of A's, represents a divalent linking group having a bond which is broken by an acid; X each independently, when there are a plurality of X's, represents a monovalent organic group having an alicyclic hydrocarbon structure; and n represents an integer of 0-2. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008083234(A) 申请公布日期 2008.04.10
申请号 JP20060261285 申请日期 2006.09.26
申请人 FUJIFILM CORP 发明人 WADA KENJI
分类号 G03F7/004;C07C229/28;G03F7/038;G03F7/039;H01L21/027 主分类号 G03F7/004
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