| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that a solder thickness varies depending on variation in component dimensions, plating dimensions, substrate electrode dimensions, and manufacture conditions when connecting an electronic component with a circuit board, resulting in variation of a solder connection service life. SOLUTION: The in-vehicle electronic circuit device is equipped, on the circuit board 2, with solder resist 4, the substrate electrode 2a, silk ink 5, or a protrusion 2b for bringing the electronic component 1 onto the circuit board 2 by their combinations. Since the variation can thus be reduced in an interval between the circuit board 2 and the electronic component 1, the variation can be reduced in the thickness of a solder layer 3. Therefore, the service life of the solder connection can be stabilized with its variation reduced. COPYRIGHT: (C)2008,JPO&INPIT
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