| 摘要 |
An apparatus and a method for bonding a substrate are provided to remove an existing plate, reduce the number of vacuum pumps by levitating an ESC base through magnetic force, and reduce pumping time. In upper and under ESC(Electro Static Chuck) bases(116,118), magnetic force can be formed. Magnets(152~157) levitate the upper and under ESC bases by the magnetic force. The magnetic is attached to an upper plate(110) and an upper base. The magnetic attached to the upper plate is formed to form magnetic force and attraction force of the upper ESC base. The magnetic attached to the upper base is formed to form magnetic force and repulsive force of the upper base. |
