| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical interconnection module having at least one of a surface light emitting element and a surface light receiving element, and capable of making compact and thin while reducing transmission loss of high frequency electric signal in the module. SOLUTION: A flexible substrate 2 mounting a VCSEL 3 is bent with a curvature larger than a predetermined value, wherein the diameter at the bend of the flexible substrate 2 is larger than the level difference between the surface at a portion of the flexible substrate 2 mounting the VCSEL 3 and the surface at a portion for making electrical connection with a circuit board 19. At the bend of the flexible substrate 2, the level difference between a portion closest to the circuit board 19 and the surface for making electrical connection with the circuit board 19 is smaller than the level difference between a portion farthest from the circuit board 19 and the surface mounting the VCSEL 3. COPYRIGHT: (C)2008,JPO&INPIT
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