METHOD FOR SOLDERING ELCTROLESS NI PLATING PART

摘要

This invention provides a method for soldering an electroless Ni plating part that can overcome a disadvantage that, when an electrolessly Ni plated BGA electrode is soldered with solder balls of lead-free solder, the soldered part is disadvantageously easily separated upon exposure to external impact. When an electrolessly Ni plated BGA electrode is soldered with lead-free solder containing 0.03 to 0.1% by mass of P, the formation of a fragile intermetallic compound of SnNi at the soldered part and the growth of a P layer on the electrolessly Ni plated surface can be suppressed to improve the bonding strength.