| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a polyimide wiring board capable of stably manufacturing the polyimide wiring board, where a metal thin film is adhered to polyimide satisfactorily, the reimidation of a reforming layer is achieved sufficiently, and the erosion of a metal thin film is suppressed fully. SOLUTION: The method of manufacturing a polyimide wiring board in an arbitrary order executes: a reforming process 1 for treating a polyimide substrate with an alkali solution; a metal ion adsorption process 2 for treating the polyimide substrate with a solution containing a metal ion, where metal capable of forming a passive state film is contained in an ion form; a metal ion reduction process 3 for performing reduction treatment to the polyimide substrate to deposit the metal thin film; a heat-treatment process 5 for performing the closed circle treatment of a polyimide reforming layer by heating, after performing an acid solution treatment process 4 for forming the passive state film to the metal thin film by treating the polyimide substrate with an acid solution; and a passive state film removal process 6 for removing the passive state film. By using the method, the polyimide wiring board is obtained. COPYRIGHT: (C)2008,JPO&INPIT
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