WAFER MANUFACTURING METHOD, POLISHING APPARATUS, AND WAFER

摘要

A wafer manufacturing method and wafer polishing apparatus in which the edge rounding of the edge of a wafer is controlled and consequently the value of nanotopology especially required recently is improved, a wafer polishing apparatus, and a wafer are disclosed. At a step of mirror-polishing a wafer, the back of the wafer is polished to form a reference surface of the wafer.