| 摘要 |
A sputtering target is provided to increase an active range of sputtering ion, to improve utilization efficiency, and to increase deposition rate by lowering a ground shield. A deposition material target(110) is comprised of a deposition material to be deposited on a substrate. The deposition material target is attached on a surface of a backing plate(120). A magnet unit(130) is arranged on a rear surface of the backing plate to form the magnetic field. A magnet driving unit(140) drives the magnet unit. The magnet driving unit is comprised of a first driving unit(142) and a second driving unit(144). The first driving unit horizontally moves the magnet unit to a parallel direction with respect to the rear surface of the backing plate. The second driving unit horizontally moves the magnet unit to a vertical direction with respect to the rear surface of the backing plate.
|
