发明名称 COVER TAPE FOR PACKAGING ELECTRONIC COMPONENTS
摘要 <p>A COVER TAPE (1)FOR PACKAGING ELECTRONIC COMPONENTS, WHICH CAN PREVENT TROUBLES ASSOCIATED WITH THE PEELING STRENGTH OR APPEARING DURING MOUNTING OF THE ELECTRONIC COMPONENTS, WHICH CAN BE PRODUCED AT A LOW COST, AND WHICH IS TRANSPARENT; THAT IS, A COVER TAPE(1)HAS A PEELING STRENGTH NOT TOO HIGH AND NOT TOO LOW AND SMALL IN DIFFERENCE BETWEEN THE MAXIMUM VALUE AND THE MINIMUM VALUE AND WHICH HAS HIGH TRANSPARENCY. SPECIFICALLY,THE COVER TAPE(1) FOR PACKAGING ELECTRONIC COMPONENTS, WHICH CAN BE HEAT-SEALED TO A PLASTIC-MADE CARRIER TAPE(7) HAVING POCKETS CAPABLE OF STORING ELECTRONIC COMPONENTS, FORMED REGULARLY THEREIN AND WHICH IS MADE OF (A) A BIAXIALLY ORIENTED FILM LAYER(2)MADE OF POLYSTER, A POLYPROPYLENE OR A NYLON AND (B) A THERMOPLASTIC RESIN LAYER COMPOSED OF 100 PARTS BY WEIGHT OF AN ETHYLENE COPOLYMER AND 10 TO 100 PARTS BY WEIGHT OF A POLYSTRENE, LAMINATED TO ONE SIDE OF THE LAYER A .FIG. 1</p>
申请公布号 MY134801(A) 申请公布日期 2007.12.31
申请号 MY2002PI02377 申请日期 2002.06.25
申请人 SUMITOMO BAKELITE COMPANY LIMITED 发明人 HISAO NAKANISHI;MASAYUKI HIRAMATSU
分类号 B32B7/02;C09J7/04;B32B27/32;B32B27/34;B32B27/36;C09J7/02 主分类号 B32B7/02
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