METHOD FOR CONTROLLING A REACTIVE HIGH-POWER PULSED MAGNETRON SPUTTER PROCESS AND CORRESPONDING DEVICE

摘要

The invention relates to the control of a reactive high-power pulsed sputter process. The invention particularly relates to a method for controlling a process of the aforementioned kind, wherein a controlled variable is measured and an adjustable variable is modified based on the measured controlled variable in order to adjust the controlled variable to a predetermined setting value. The method according to the invention is characterized by modifying the discharge capacity by varying the pulse frequency of the discharge.