发明名称 Component with Encapsulation Suitable for Wlp and Production Method
摘要 An electrical component includes a substrate that includes one or more terminal contacts for one or more electrical component structures on a surface of the substrate. The electrical component also includes a cover having a first surface and a second surface. The cover includes one or more terminal pads on the first surface, one or more terminal contacts on the second surface, and electrical throughplatings electrically connecting the terminal pads and the contacts. The cover is on the surface of the substrate. The electrical component also includes a conductive adhesive is in one or more cavities between the substrate and the cover.
申请公布号 US2007290374(A1) 申请公布日期 2007.12.20
申请号 US20050591027 申请日期 2005.01.14
申请人 发明人 WOLFGANG PAHL
分类号 H01L23/48;H01L21/44;H01L23/31;H01L23/498;H01L23/538;H05K1/18;H05K3/00;H05K3/40;H05K3/46 主分类号 H01L23/48
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