发明名称 PRINTED WIRING BOARD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a printed wiring board which can be manufactured by conventional manufacturing facilities for printed wiring boards, and wherein the deformation of a signal waveform is prevented. <P>SOLUTION: The printed wiring board 1 is provided with wiring layers L1-L6 wherein a transmission line is formed over a signal layer L1 and a signal L3 through a via hole 2. The via hole 2 is electrically connected to a resistance element 3 which is arranged immediately near the signal layer L6 as a hole end on the side of the signal layer L3. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2007317716(A) 申请公布日期 2007.12.06
申请号 JP20060142837 申请日期 2006.05.23
申请人 RICOH CO LTD 发明人 TADOKORO YOSHIKAZU;MAKINO TOSHIHIKO
分类号 H05K3/46;H05K1/02 主分类号 H05K3/46
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