| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermoelectric module capable of reducing stress which works on a thermoelectric element. SOLUTION: The thermoelectric module 1 includes: the thermoelectric elements 4; a top substrate 3 to be joined with the thermoelectric elements 4; a bottom substrate 2 arranged to face the top substrate 3 and provided with a joining part 2c to be joined with the thermoelectric elements 4, and a power feed 2d having post electrodes 6a, 6b for feeding power to the thermoelectric elements 4; and a metalized layer 7 arranged on the bottom substrate 2 so as to join the bottom substrate 2 to a package 10 by soldering. The bottom substrate 2 includes: a facing surface 2a to be joined with the thermoelectric elements 4; and outer side surface 2b with the metalized layer 7 arranged thereon. The metalized layer 7 is arranged by division into the joining part 2c and the power feed 2d. COPYRIGHT: (C)2008,JPO&INPIT |
