METHOD FOR DIVIDING BRITTLE SUBSTRATE AND METHOD FOR PRODUCING ELEMENT

摘要

PROBLEM TO BE SOLVED: To divide a brittle substrate without adding external mechanical force after the substrate is irradiated with laser beams when the substrate is divided by forming parting lines which cross and extend.

SOLUTION: The glass substrate 11 is divided into a plurality of parts by a method in which the substrate is irradiated with laser beams and sprayed with a refrigerant to grow cracks. The method includes the first crack forming process for forming the first crack 16 extending in the first direction of the glass substrate 11 and the second crack forming process which is carried out after the first crack forming process and in which the second crack 17 extending in the second direction crossing the first direction. In the first crack 16, a part crossing the second crack 17 is formed in a half cut. The second crack 17 is formed in a full cut over the entire length. The half cut part 16a of the first crack 16 is formed in a full cut by being irradiated with break laser beams 14a when the second crack 17 is formed.

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