SEMICONDUCTOR PACKAGE AND METHOD OF ASSEMBLING A SEMICONDUCTOR PACKAGE

摘要

A semiconductor package (24; 26) comprises a semiconductor component (1) including a circuit carrier (2; 27) , a semiconductor chip (3) and a plurality of electrical connections (4) . An adhesion promotion layer (22) is disposed on at least areas of the semiconductor component (1) and plastic encapsulation material (25) encapsulates at least the semiconductor chip (3), the plurality of electrical connections (4) and the plurality of the inner contact pads (9) . Surface regions (17) of the semiconductor component (1) are selectively activated.