ADHESIVE SHEET AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an adhesive sheet excellent in heat resistance and moisture resistance and exhibiting improved filling properties to an irregular surface subjected to thermal hysteresis when it is used for bonding a semiconductor chip to a supporting member for mounting the semiconductor chip. SOLUTION: The adhesive sheet is employed in a manufacturing process of a semiconductor device comprising a step for bonding a semiconductor chip to a supporting member 20 for mounting the semiconductor chip through an adhesive layer 10 having a modulus of elasticity in tension of 0.1-2 MPa at 170°C when it is hardened by heating 5 hours at 170°C and storage elasticity of 1-6 MPa at 200°C under such a state as an air gap is left between the adhesive layer 10 and the irregular surface of the supporting member 20, and a step for resin sealing the semiconductor chip A1 connected to the supporting member 20 and filling the air gap with the adhesive layer 10. COPYRIGHT: (C)2008,JPO&INPIT