发明名称 Wafer Manufaturing Method and Wafer Manufaturing Apparatus
摘要 <p>A semiconductor manufacturing method and a semiconductor manufacturing apparatus are provided to load compactly semiconductor substrates into a boat and to improve productivity by using an improved arrangement of support rods. A holder ring(12) is used for supporting a lower edge portion of a semiconductor substrate. A plurality of support rods(16) are protruded from a boat frame(22) in order to support holder rings. The plurality of support rods are properly arranged with each other, so that an end effector(18) is capable of performing substrate loading/unloading processes without the impact between the support rod and the end effector itself.</p>
申请公布号 KR100772462(B1) 申请公布日期 2007.11.01
申请号 KR20050119392 申请日期 2005.12.08
申请人 发明人
分类号 H01L21/02 主分类号 H01L21/02
代理机构 代理人
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