发明名称 |
Polishing apparatus and polishing method |
摘要 |
A polishing apparatus is used for polishing and planarizing a substrate such as a semiconductor wafer on which a conductive film such as a copper (Cu) layer or a tungsten (W) layer is formed. The polishing apparatus includes a polishing table having a polishing surface, a motor for rotating the polishing table, a top ring for holding a substrate and pressing the substrate against the polishing surface, a film thickness measuring sensor disposed in the polishing table for scanning a surface of the substrate, and a computing device for processing signals of the film thickness measuring sensor to compute a film thickness of the substrate.
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申请公布号 |
US2007239309(A1) |
申请公布日期 |
2007.10.11 |
申请号 |
US20070730891 |
申请日期 |
2007.04.04 |
申请人 |
TADA MITSUO;TAKAHASHI TARO;NIIJIMA MOTOHIRO;OHTA SHINRO;SHIGETA ATSUSHI |
发明人 |
TADA MITSUO;TAKAHASHI TARO;NIIJIMA MOTOHIRO;OHTA SHINRO;SHIGETA ATSUSHI |
分类号 |
G06F19/00;B24B37/013;B24B49/04;B24B49/10;B24B49/12;H01L21/304 |
主分类号 |
G06F19/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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