| 摘要 |
A film type package and a display apparatus having the same are provided to improve productivity of a semiconductor by performing a test for performance of a driving integrated circuit through a test line after packaging of a film type package. A film type package includes a base film, a driving integrated circuit(211), a plurality of signal lines(212), a plurality of bonding pads(213,214), and a test line. The driving integrated circuit(211) is mounted on the base film, and inputs/outputs signals from objects. The plurality of signal lines(212) are formed on the base film(212), and transmit the signals between the objects and the driving integrated circuit(211). The plurality of bonding pads(213,214) are formed on a side of the base film to connect the plurality of signal lines(212) with the objects. The plurality of bonding pads(213,214) correspond to the plurality of signal lines(212) respectively. The test line is coupled to the driving integrated circuit(211), and transmits test signals outputted from the driving integrated circuit(211). The test line is spaced apart from the adjacent signal line of the plurality of signal lines(212). |
