| 摘要 |
<p>A tray for a chip scale package is provided to properly absorb a semiconductor chip in a proper position by preventing the semiconductor chip from being separated from the proper position when a tray having a mounted semiconductor chip is loaded onto a work table in a work line. A plurality of chip mounting grooves(15) are arranged as a lattice type on the upper surface of a rectangular frame(10). A semiconductor chip is mounted on the chip mounting groove. A sheet member(25) made of a softer material than that of the frame is attached to the chip mounting groove of the frame by an attach unit. The attach unit can be made of adhesive, and the lower surface of the sheet member can be attached to the upper surface of the chip mounting groove of the frame by the adhesive.</p> |
