FLEX.RIGIDITY SUBSTRATE, SECONDARY BATTERY PROTECTION MODULE, BATTERY PACK, AND METHOD FOR MANUFACTURING FLEX.RIGIDITY SUBSTRATE

摘要

A flex/rigid substrate, a secondary battery protection module and a battery pack using the same, and a manufacturing method thereof are provided to be capable of bending a flexible substrate at a right angle and to prevent an adhesive of a prepreg material from oozing out of a side end of the circuit board. A flex/rigid substrate(20A) has a circuit board(21,27), a flexible substrate(25) and a prepreg material(23A) which adheres the circuit board to the flexible substrate, wherein the prepreg material(23A) is smaller in dimension than the circuit board. Preferably, the prepreg material is smaller in dimension than the circuit board at a location where the flexible substrate is extended from the circuit board. The prepreg material is smaller in dimension than the circuit board to an extent from which a resin of the prepreg material does not ooze to the flexible substrate over a side end(21u,27u) of the circuit board when adhering the circuit board to the flexible substrate with a laminating press.