| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin-fitted copper foil which has a very high reliability in inter-layer adhesion and inter-layer connection and allows producing a high-density, high-lamination multitude multi-layer wiring board in serial lamination. SOLUTION: A resin attached copper foil (100a) comprises an insulating substrate (10) keeping a resin composition, a copper foil (20a) overlying one surface side of the insulating substrate (10), and an adhesive layer (30a) overlying the other side of the insulating substrate (10), wherein the adhesive layer (30a) comprises a blend of an alkenyl phenol compound and a maleimide. COPYRIGHT: (C)2007,JPO&INPIT |
