发明名称 REDUCED PRESSURE DRY PROCESSING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a reduced pressure dry processing device capable of efficiently processing an enlarged substrate. SOLUTION: An uppermost plate 14 is attached to lower ends of rods 11 in a cylinder unit 10 through reinforced plates 13. The size of the uppermost plate 14 should be big enough to cover the substrate W. The uppermost plate is further thinner than the reinforced plate 13 to achieve lightweightness. In addition, the reinforced plate 13 is composed of four sheets of divided plates 13a of 45°made with each side of the uppermost plate 14 as viewed dimensionally and a connection member 13b communicating these divided plates 13a. Because a rectangular frame-like reinforced plate 13 is formed by communicating each divided plate 13a, and the reinforced plate 13 and the uppermost plate 14 are mounted by deviating a phase of 45°between them as viewed dimensionally, the system can prevent the uppermost plate 14 from being deformed to torsion. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007235094(A) 申请公布日期 2007.09.13
申请号 JP20060325216 申请日期 2006.12.01
申请人 TOKYO OHKA KOGYO CO LTD 发明人 TAKASE SHINJI;KAJIMA ATSUO
分类号 H01L21/027;F26B5/04 主分类号 H01L21/027
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