A method for forming a flexible circuit board includes placing an adhesive coated coverlay over a flexible media, placing a release film over the adhesive coated coverlay and compressing together the flexible media, the adhesive coated coverlay, and the release film. The flexible media includes circuitry. The release film includes a multi-layer film having first and second layers. The first layer includes an elastomer and the second layer includes a fluoropolymer.
申请公布号
WO2007103011(A2)
申请公布日期
2007.09.13
申请号
WO2007US04850
申请日期
2007.02.23
申请人
SAINT-GOBAIN PERFORMANCE PLASTICS CORPORATION
发明人
SWEI, GWO, SHIN;KASTELIC, JOHN, R.;ORTIZ, PAUL, W.