| 摘要 |
PROBLEM TO BE SOLVED: To provide an ultrasonic bonding method capable of suppressing the wear of a suction member for sucking and holding a chip component such as an electronic component wherein, while the electrode of the chip component is being pressed against the electrode of a work such as a substrate and heated, ultrasonic vibration is applied to that bonding portion to carry out the bonding. SOLUTION: The primary bonding between the electrode of the chip component and the electrode of the work is carried out by applying the ultrasonic vibration, and the ultrasonic vibration is temporarily suspended. Then, ultrasonic vibration having an amplitude larger than that upon the primary bonding is applied, or plural times of bonding is carried out by applying the ultrasonic vibration under the same condition to effect the ultrasonic bonding between the electrode of the chip component and the electrode of the work. COPYRIGHT: (C)2007,JPO&INPIT |
