| 摘要 |
PROBLEM TO BE SOLVED: To mount electronic components in a substrate, in a state where the external connection terminals of the electronic components and a circuit wiring pattern of the substrate are connected securely. SOLUTION: The manufacturing method of an electronic component mounter 30 is constituted such that a connecter component 20 is provided with a pair of fixing brackets 21 formed in a part at both ends respectively, and with two or more external connection terminals 22 formed between the pair of fixing brackets 21, and that the connector component is mounted in a printed wiring substrate 10 having a first wiring pattern 11 and a second wiring pattern 12. The manufacturing method comprises a solder application process for applying solder paste 26a to the second wiring pattern 12 of the printed wiring substrate 10; an electronic component arrangement process for arranging the connector component 20 to the printed wiring substrate 10; a reflow process for heating the printed wiring substrate 10, and for connecting each external connection terminal 22 and the second wiring pattern 12 via solder 26; and a soldering process for soldering each fixing bracket 21 and the first wiring pattern 11 with a soldering iron 5. COPYRIGHT: (C)2007,JPO&INPIT
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