| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board in which electric connection with an inner layer circuit in a core substrate can sufficiently be secured through a through-hole, even if the core substrate is made into multiple layers, and which is advantageous to high density of the through hole. SOLUTION: In the multilayer printed wiring board, a built-up wiring layer is formed where an interlayer resin insulating layer and a conductor layer are alternately laminated on the multilayer core substrate having a conductor layer in an inner layer, and the conductor layers are connected in a via hole. A plurality of the conductor layers formed on the multilayer core substrate by an etching processing in a state where a nonelectrolytic plating film and an electrolytic plating film are given, are installed. The through-hole is formed in the multilayer core substrate. The through-hole is filled with a fill, and an exposure face of the fill from the through-hole is covered with a part of a plurality of the conductor layers. The via hole is connected to the conductor layer covering the exposure face. COPYRIGHT: (C)2007,JPO&INPIT |
