发明名称 SOLID-STATE IMAGING APPARATUS AND MANUFACTURING METHOD THEREFOR
摘要 <P>PROBLEM TO BE SOLVED: To provide a solid-state imaging apparatus and a manufacturing method therefor, capable of suppressing recognition fault of a solid-state imaging element due to infiltration of dust, and of improving the manufacturing yield by simplifying manufacturing processes so as to improve the product quality. <P>SOLUTION: The solid-state imaging apparatus includes a structure made of an insulation resin and having a through-opening; a wiring part formed on the surface of the structure; the solid-state imaging element, connected to the wiring part and mounted on the structure in a way of closing the through-opening; and a transparent member in a way of closing the through-opening apart from the solid-state imaging element at a prescribed interval, and a transparent filler is filled in a space formed by the through-opening of the structure, the solid-state imaging element, and the transparent member. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007194737(A) 申请公布日期 2007.08.02
申请号 JP20060009158 申请日期 2006.01.17
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 NAKAGIRI YASUSHI;HARAZONO BUNICHI;SUGAWARA TAKESHI
分类号 H04N5/335;H04N5/225 主分类号 H04N5/335
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