| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a stacked semiconductor device which can be improved in interlayer connection reliability and can be reduced in manufacturing cost, and to provide its manufacturing method. <P>SOLUTION: The stacked semiconductor device 1 comprises a plurality of semiconductor devices 3 and 4 which have circuit boards 6 and 11 for ball grid array whereon semiconductor chips 5 and 10 are to be mounted, and which are joined together into a stacked state by reflow mounting using solder balls 2 for interlayer connection. On both sides of each edge part of the chip mounting face of the circuit board 6, projections 8 are formed for restricting the inclination of the board. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
