发明名称 |
MANUFACTURING METHOD OF CIRCUIT BOARD, AND CIRCUIT BOARD |
摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a circuit board by which a narrow pitch of a conductor pattern is possible, and the circuit board. SOLUTION: The manufacturing method of the circuit board comprises: a current-carrying layer forming process of forming a current-carrying layer 6 on an insulating substrate 2; a mask forming process of forming a mask 11 for patterns on the current-carrying layer 6; and a conductor layer forming process of forming a conductor layer 7 by means of a PR electrolytic plating treatment periodically inverting a current direction in a non-forming region of the mask 11 for patterns on the current-carrying layer 6. COPYRIGHT: (C)2007,JPO&INPIT
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申请公布号 |
JP2007180476(A) |
申请公布日期 |
2007.07.12 |
申请号 |
JP20060164807 |
申请日期 |
2006.06.14 |
申请人 |
TOPPAN PRINTING CO LTD |
发明人 |
ICHIKAWA KOJI;TANIGUCHI TOMOAKI;HITSUOKA YOSHIYUKI |
分类号 |
H05K3/18;C25D5/18;C25D7/00;H01L23/12;H05K1/02;H05K3/24 |
主分类号 |
H05K3/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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