发明名称 MANUFACTURING METHOD OF CIRCUIT BOARD, AND CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a circuit board by which a narrow pitch of a conductor pattern is possible, and the circuit board. SOLUTION: The manufacturing method of the circuit board comprises: a current-carrying layer forming process of forming a current-carrying layer 6 on an insulating substrate 2; a mask forming process of forming a mask 11 for patterns on the current-carrying layer 6; and a conductor layer forming process of forming a conductor layer 7 by means of a PR electrolytic plating treatment periodically inverting a current direction in a non-forming region of the mask 11 for patterns on the current-carrying layer 6. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007180476(A) 申请公布日期 2007.07.12
申请号 JP20060164807 申请日期 2006.06.14
申请人 TOPPAN PRINTING CO LTD 发明人 ICHIKAWA KOJI;TANIGUCHI TOMOAKI;HITSUOKA YOSHIYUKI
分类号 H05K3/18;C25D5/18;C25D7/00;H01L23/12;H05K1/02;H05K3/24 主分类号 H05K3/18
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