| 摘要 |
PROBLEM TO BE SOLVED: To suppress the occurrence of conductive connection defects, caused by the reduction in the adhesive strength of insulating resin for making improved the electrical reliability of the mounting structure of a substrate and an electronic component bonded with insulating resin or an electro-optical device, including this mounting structure. SOLUTION: An electro-optical device 100 has a substrate 126, on which an electro-optical material is disposed, and an electronic component 130 is mounted on the substrate 126. A conductor, provided on the substrate and an electrode provided to the electronic component are conductively connected directly or indirectly, and the substrate and the electronic component are bonded by the insulating resin, and an inhibitor 140 which generates reaction, at least when the conductor and the electrode are separated is provided separate from the insulating resin. COPYRIGHT: (C)2007,JPO&INPIT
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