MICROSTRUCTURE INSPECTING APPARATUS AND MICROSTRUCTURE INSPECTING METHOD

摘要

A voltage is applied to a chip (TP) by a voltage driving part (30) through a probe needle (P) and a movable part of a microstructure is moved. A sound generated in response to the movement of the movable part of the microstructure is detected by a microphone (3). Then, the sound detected by the microphone (3) is measured by a measuring part (25), and characteristics of the detecting chip (TP) are evaluated by a control part (20) based on comparison with a sound detected from an ideal chip (TP).