| 摘要 |
The device of the invention includes a plurality of isolation layers formed at predetermined regions of a semiconductor substrate and running parallel with each other. The devices of the present invention also include a high voltage PMOS placed on top of a deep N-well and NMOS placed above a triple P-well inside the deep N-well in the peripheral area to pass both positive and negative high voltage of around +20V and -20V to the cell area. In one embodiment, the cell array, source lines and bit lines are all placed on top of the P-substrate without a deep N-well or Triple P-well. In other embodiments, the cell array, source lines and bit lines are placed on top of the deep N-well and triple P-well.
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