| 发明名称 |
Semiconductor device socket |
| 摘要 |
In a state wherein front ends of latch members 18 A and 18 B are apart from each other so that the upper surface of an alignment plate/positioning member 24 is outside, a pressing section 12 PU of a heat sink member 12 is brought into contact with the periphery of a semiconductor device 22.
|
| 申请公布号 |
US7230830(B2) |
申请公布日期 |
2007.06.12 |
| 申请号 |
US20050106461 |
申请日期 |
2005.04.15 |
| 申请人 |
YAMAICHI ELECTRONICS CO., LTD. |
发明人 |
UJIKE RYO;OIKAWA TAKAHIRO;SUZUKI KATSUMI;KOBORI EIJI;TSUBOTA EISAKU |
| 分类号 |
H01R33/76;H05K7/20;G01R1/04;H01L23/34;H01L23/40;H01R12/00;H01R13/62 |
主分类号 |
H01R33/76 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
