MULTI-LAYER MOLD STRUCTURE FOR HOT EMBOSSING

摘要

A multi-layer molding apparatus for hot embossing is provided to achieve improved large area transferring performance of hot embossing by applying uniform pressure all over the molding apparatus. A multi-layer molding apparatus includes a molding layer(110), a cushion layer(120), and a rigidity retention layer(130). The molding layer is constituted by a wafer made of silicon. The wafer has one surface on which fine patterns(111) are formed. The cushion layer has one surface bonded to the other surface of the molding layer, and transforms in correspondence to the pressure generated when a material is pressed by the molding layer. The rigidity retention layer is bonded to the other surface of the cushion layer, and provides a flat reference surface which is not transformed even when the material is pressed by the molding layer.