| 摘要 |
A method and apparatus for attaching a peeling tape are provided to control exactly a tape attaching process, to prevent the bonding between the peeling tape and a dicing tape, and to prevent the crack of a wafer. An apparatus for attaching a peeling tape(4) on a surface protection film(11) of a wafer includes a driving table, a supply unit, a peeling tape attaching unit, a pressurizing unit. The driving table(31) is used for supporting the wafer. The driving table is capable of moving to and fro. The supply unit is used for supplying a peeling tape onto the surface protection film. The peeling tape attaching unit(60) is used for attaching the peeling tape to the surface protection film. The pressurizing unit is used for pressurizing the peeling tape attaching unit against the surface protection film. The pressurizing force of the pressurizing unit is applied to the surface protection film through the peeling tape when an end portion of the wafer is positioned under the peeling tape attaching unit by the driving table. |
