| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device in which, after a flip-chip connection is completed, an underfill resin layer is formed between a semiconductor chip and a wiring board, and even after this layer is cured, the wiring board and the semiconductor chip are warked less or a connection is broken less. <P>SOLUTION: The method for manufacturing a semiconductor device comprises the steps of: sucking a board 9 which comprises a plurality of wiring boards having a chip mounting area 14 to an upper face of a stage 1 having the upper face as a vacuum sucking face; mounting the semiconductor chip to the chip mounting area 14 of the board 9 retained by the stage 1, so that the semiconductor chip is connected to the board 9 by a flip-chip condition; thereafter, pouring a liquid-like resin 12 into between the board 9 and the semiconductor chip on the stage 1, in a state that the board 9 is retained by vacuum sucking and heating and curing the liquid-like resin 12 poured on the stage 1, in a state that the board 9 is retained by vacuum sucking to form an underfill resin layer 15. Thereafter, a lamination of chips, a bonding wire and a resin sealing, etc. are performed. <P>COPYRIGHT: (C)2007,JPO&INPIT |
