发明名称 WORKPIECE HOLDING MECHANISM
摘要 A WORKPIECE HOLDING MECHANISM (4) IS USED FOR HOLDING A WAFER. THE WAFER IS SANDWICHED BETWEEN A HOLDING PLATE (6) OF THE WORKPIECE HOLDING MECHANISM (4) AND A POLISHING PAD (2) ATTACHED TO A POLISHING TURN TABLE (1). THE WORKPIECE (W) IS PRESSED AGAINST THE POLISHING PAD (2) WITH A PREDETERMINED PRESSURE SO THAT THE BOTTOM SURFACE OF THE WAFER IS POLISHED. WAFER IS CONFINED WITHIN A FLUID CONFINEMENT SPACE (11) DEFINED BETWEEN AN ELASTIC MEMBRANE (7) AND THE HOLDING PLATE (6) SO AS TO PRESS THE WAFER VIA THE ELASTIC MEMBRANE (7). THERE IS PROVIDED A VOLUME ADJUSTMENT SCREW (13) THAT CAN BE ADVANCED TOWARD THE FLUID CONFINEMENT SPACE (11) AND BE RETRACTED THEREFROM. THROUGH ADJUSTMENT OF THE SCREW (13), THE ELASTIC MEMBRANE (7) IS CAUSED TO HAVE A FLAT SURFACE, SO THAT THE ELASTIC MEMBER (7) IS IN CLOSE CONTACT WITH THE ENTIRE SURFACE OF THE WAFER.A HOLDING MEMBRANE (8) MADE OF POLYURETHANE FOAM IS BONDED TO THE SURFACE OF THE ELASTIC MEMBRANE (7), AND A TEMPLATE (9) IS BONDED TO THE SURFACE OF THE HOLDING MEMBRANE (8) SO AS TO IMPROVE THE HOLDING PERFORMANCE. ACCORDINGLY, A UNIFORM PRESSURE CAN BE APPLIED ONTO THE WAFER DURING POLISHING, AND THE WAFER IS PREVENTED FROM SHIFTING FROM A DESIRED POSITION EVEN WHEN POLISHING IS PERFORMED AT A HIGH SPEED.(FIG 1)
申请公布号 MY129950(A) 申请公布日期 2007.05.31
申请号 MY1997PI00635 申请日期 1997.02.20
申请人 SHIN-ETSU HANDOTAI CO., LTD. 发明人 FUMIHIKO HASEGAWA;MAKOTO KOBAYASHI;FUMIO SUZUKI
分类号 B24B37/04;B24B37/30;H01L21/304 主分类号 B24B37/04
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