| 摘要 |
PROBLEM TO BE SOLVED: To reduce index time in a test process, and hence to increase throughput. SOLUTION: A device is provided with a first suction head 304c that transfers an IC to be tested being carried into a first position CR5 of a test process to a contact part 302a of a test head 302 for performing a test, and sweeps the IC to be tested from the contact part 302a, and a second suction head 304c that transfers the IC to be tested being carried into a second position CR5 of the test process to the contact part 302a for performing a test, and sweeps the IC to be tested from the contact part 302a. |
