发明名称 Method of manufacturing flexible laminate substrate
摘要 Disclosed is a method of manufacturing a flexible laminate substrate having an improved appearance and dimensional stability after removal of a metal foil. Specifically disclosed is a method of manufacturing a flexible laminate substrate 5 wherein a metal foil 2 is bonded to at least one surface of a heat-resistant adhesive film 3 . The method comprises a step wherein the heat-resistant adhesive film 3 and the metal foil 2 are thermally laminated between a pair of metal rolls 4 via a protective film 1 , thereby forming a laminate 7 wherein the heat-resistant adhesive film 3 , the metal foil 2 , and the protective film 1 are bonded together, and another step wherein the protective film 1 is removed. The tension of the laminate 7 at the time when the protective film 1 is removed is higher than the tension of the laminate 7 before the removal of the protective film 1.
申请公布号 US2007113972(A1) 申请公布日期 2007.05.24
申请号 US20040584352 申请日期 2004.12.20
申请人 KANEKA CORPORATION 发明人 KIKUCHI TAKASHI;TSUJI HIROYUKI
分类号 B32B37/12;B29C65/00;B29C65/02;B32B37/26;H05K1/00;H05K3/02 主分类号 B32B37/12
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