| 发明名称 |
ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE OF CIRCUIT CONNECTORS, AND SEMICONDUCTOR DEVICES |
| 摘要 |
<p>An adhesive composition which contains an adhesive component comprising a thermoplastic resin, a radical-polymerizable compound, and a radical polymerization initiator, wherein the adhesive component exhibits a signal in the ESR measurement at 25°C.</p> |
| 申请公布号 |
WO2007046190(A1) |
申请公布日期 |
2007.04.26 |
| 申请号 |
WO2006JP316589 |
申请日期 |
2006.08.24 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD.;SHIRASAKA, TOSHIAKI;KATOGI, SHIGEKI |
发明人 |
SHIRASAKA, TOSHIAKI;KATOGI, SHIGEKI |
| 分类号 |
C09J4/00;C09J7/00;C09J9/02;C09J11/06;H01B1/22;H01B5/16;H01L21/60;H01R11/01;H05K3/36 |
主分类号 |
C09J4/00 |
| 代理机构 |
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代理人 |
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