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发明名称
Structure for heat dissipation of intelligent power module
摘要
申请公布号
KR100708679(B1)
申请公布日期
2007.04.17
申请号
KR20050029595
申请日期
2005.04.08
申请人
发明人
分类号
H01J17/28
主分类号
H01J17/28
代理机构
代理人
主权项
地址
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