发明名称 Integrated circuit interconnect structure having reduced coupling between interconnect lines
摘要 An interconnect structure in which "diagonal" and "straight" interconnect lines are interleaved to minimize coupling between adjacent interconnect lines. An interconnect structure for an integrated circuit comprises rows and columns of tiles. Interconnect lines extend at least in part along a first column of the tiles, the interconnect lines including straight and diagonal interconnect lines. A "straight" interconnect line interconnects at least two tiles in the first column, and a "diagonal" interconnect line interconnects a tile in the first column with at least one tile in a different column and row. The interconnect lines are laid out in parallel fashion such that no straight interconnect line is physically adjacent to more than one other straight interconnect line, and no diagonal interconnect line is physically adjacent to more than one other diagonal interconnect line. Optionally, no two physically adjacent interconnect lines drive in the same direction within the first column.
申请公布号 US7199610(B1) 申请公布日期 2007.04.03
申请号 US20050152360 申请日期 2005.06.14
申请人 发明人
分类号 H03K19/177 主分类号 H03K19/177
代理机构 代理人
主权项
地址