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发明名称
Method of forming a metal wiring in a semiconductor device
摘要
申请公布号
KR20070031541(A)
申请公布日期
2007.03.20
申请号
KR20050086086
申请日期
2005.09.15
申请人
发明人
分类号
H01L21/28
主分类号
H01L21/28
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代理人
主权项
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