发明名称 |
Wafer-to-wafer alignments |
摘要 |
Structures for aligning wafers and methods for operating the same. The structure includes (a) a first semiconductor wafer including a first capacitive coupling structure, and (b) a second semiconductor wafer including a second capacitive coupling structure. The first and second semiconductor wafers are in direct physical contact with each other via a common surface. If the first and second semiconductor wafers are moved with respect to each other by a first displacement distance of 1 nm in a first direction while the first and second semiconductor wafers are in direct physical contact with each other via the common surface, then a change of at least 10<SUP>-18 </SUP>F in capacitance of a first capacitor comprising the first and second capacitive coupling structures results. The first direction is essentially parallel to the common surface.
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申请公布号 |
US7193423(B1) |
申请公布日期 |
2007.03.20 |
申请号 |
US20050275112 |
申请日期 |
2005.12.12 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
DALTON TIMOTHY JOSEPH;GAMBINO JEFFREY PETER;JAFFE MARK DAVID;LUCE STEPHEN ELLINWOOD;SPROGIS EDMUND JURIS |
分类号 |
G01R27/26;G01R31/02 |
主分类号 |
G01R27/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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