| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component storage package that ensures a high parallelism between an insulating base and a lid, a long-term reliability and a good reliability for moisture absorption, and to provide the electronic apparatus. <P>SOLUTION: The electronic component storage package X includes an insulating base 10 with a mount area 11 for mounting an electronic component D, a lid 30 for determining a storage space A for housing the insulating base 10 and electronic component D, and a bond 60 for bonding the insulating base 10 and electronic component 30. The insulating base 10 has, in an area adjacent to the bond 60, one or more grooves 12 where one end extends up to the storage space A and the other end extends up to the outer space. <P>COPYRIGHT: (C)2007,JPO&INPIT |
